TSP 2020 Conference to be an online event due to Coronavirus! The current worldwide situation regarding COVID-19 is seriously affecting all travel plans to/from Italy. The TSP 2020 Organizing Committee members have been monitoring the situation over the past weeks, with full attention for the health and safety of all presenters, exhibitors and attendees, and have explored all options to maintain the event as planned, in close cooperation with IEEE. The current situation, with restrictions imposed by the European Commission, the Government of Italy, Municipality of Milan, and the hosting venue, no longer allows the conference to proceed in the traditional face-to-face format in 2020. Therefore, it has been decided to organize TSP 2020 as a virtual conference during the same period of the planned physical event scheduled to Milan, from July 7 to 9, 2020. To implement this, the following actions are taken:
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The OpenConf Peer Review & Conference Management System will be set up to allow authors of accepted papers in main tracks, workshops, and special sessions to mandatorily upload presentation file (.ppt, .pptx, or .pdf) or a presentation with recorded audio, and made available for online viewing by all registrants.
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The virtual conference will not include the opening & closing sessions, keynote sessions, etc.
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All papers presented in the virtual conference (having available presentation file for online viewing) will be submitted for indexing to the IEEE Xplore® Digital Library and other announced databases.
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Authors of accepted papers must still register and pay a registration fee. The Conference Organizers will apply significant discount on registration fees and reserves the right to not include a paper to proceedings, if the Conference fee is not paid by due date.
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Technical details concerning the size, format, and upload instructions for presentations with recorded audio will be announced later.
General Information
Welcome to the official website of the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP – IEEE Conference Record #49548), which will be held during July 7-9, 2020, in Milan, Italy.
In cooperation with the IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society, the TSP 2020 is organized by eighteen universities from Czech Republic, Hungary, Turkey, Croatia, Taiwan, Japan, Slovak Republic, Spain, Bulgaria, France, Romania, Slovenia, Greece, and Poland, for academics, researchers, and developers and it serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa. The international expansion motivates the organizers in their effort to providing a platform for exchanging information and experience to help to improve the level and extent of scientific cooperation between university students, academics, and employees of research centers. The official language of the conference is English.
All the accepted papers will be published in the conference proceedings issued online, which (containing only presented papers at the conference) will be submitted for indexing to the IEEE Xplore® Digital Library – IEEE Conference Record #49548, Conference Proceedings Citation Index (CPCI) of Thomson Reuters (formerly ISI Proceedings), SCOPUS, DBLP, and Google Scholar databases.
After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in special issues of international journals:
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High quality papers will be invited to submit an extended version of their work for potential publication in a Special Issue “Selected Papers from the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP)” of an international journal Applied Sciences (ISSN 2076-3417; CODEN: ASPCC7), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (2018 JCR Q2/Q3; Impact Factor: 2.217), Scopus, Inspec, etc. The submitted papers must have at least 50% new material from the conference original papers.
Guest Editors: Assoc. Prof. Norbert Herencsar (Brno University of Technology, Czech Republic); Prof. Dr. Francesco Benedetto (University of “Roma TRE”, Italy), Assoc. Prof. Jorge Crichigno (University of South Carolina, USA).
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High quality papers will be invited to submit an extended version of their work for potential publication in a Special Issue “Advances in Signal Processing Techniques for Ground Penetrating Radar Applications” of an international journal Remote Sensing (ISSN 2072-4292), is a peer-reviewed open access journal about the science and application of remote sensing technology, and is published semi-monthly online by MDPI and indexed by Web of Science (2018 JCR Q1; Impact Factor: 4.118), Scopus (2018 CiteScore: 4.89), Inspec, etc. The submitted papers must have at least 50% new material from the conference original papers.
Guest Editors: Prof. Dr. Fabio Tosti and Prof. Dr. Amir M. Alani (both with University of West London (UWL), UK), Prof. Dr. Francesco Benedetto (University of “Roma TRE”, Italy), Dr. Luca Bianchini Ciampoli (Università degli Studi Roma Tre, Italy), Prof. Dr. Evert C. Slob (Delft University of Technology, The Netherlands), Dr. Francesco Soldovieri (National Research Council of Italy (CNR), Italy).
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High quality papers will be invited to submit an extended version of their work for potential publication in a Special Issue “Signal Processing Circuits and Systems for Smart Sensing Applications” of an international journal Sensors (1424-8220; CODEN: SENSC9), is the leading international peer-reviewed open access journal on the science and technology of sensors. Sensors is published semi-monthly online by MDPI and indexed by Web of Science (2018 JCR Q1/Q2; Impact Factor: 3.031), Scopus (2018 CiteScore: 3.72), Inspec, etc. The submitted papers must have at least 50% new material from the conference original papers.
Guest Editors: Assoc. Prof. Norbert Herencsar (Brno University of Technology, Czech Republic); Prof. Dr. Khaled N. Salama (King Abdullah University of Science and Technology, Saudi Arabia)
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The extended version of selected TSP 2019 papers will be published in the International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) journal (ISSN: 1805-5443) – indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals (DOAJ) (papers to be published after significant extension and new review process).
Latest News
January 1, 2021! The 2021 44th International Conference on Telecommunications and Signal Processing (TSP) will be held during July 5-7, 2021 (Virtual Event).
January 1, 2021! The TSP 2020 Conference Proceedings are indexed in Web of Science (formerly Conference Proceedings Citation Index (CPCI) of Thomson Reuters), i.e. including with the IEEE Xplore® Digital Library, SCOPUS, DBLP, and Google Scholar in all announced databases (presented papers only)!
May 15, 2020! Announcement: The review process of TSP 2020 papers is successfully finished. The TSP Organizing Committee is thankful to reviewers for their careful evaluation. Authors can Check Status of their submissions in Peer Review & Conference Management System. Official notification emails of acceptance/rejection are sent out.
March 24, 2020! The Paper Submission System is open for Late Breaking News Papers until April 10, 2020 @ 6PM CET. Prospective authors are invited to submit full papers (3 to 4 pages in two-column TSP template) describing original work. All the papers accepted will be published in the conference proceedings issued online and submitted for indexing to the announced databases.
February 27, 2020! The 4th International Workshop on Recent Advances in Biometrics and its Applications organized by Assoc. Prof. Dr. Larbi Boubchir and Prof. Boubaker Daachi (both with the LIASD – University of Paris 8, France) will be co-located with TSP 2020.
February 15, 2020! Due to numerous requests the deadline for Full Paper Submissions to Regular tracks, Workshops, and Special Sessions is extended until March 9, 2020 (23 extra days).
February 12, 2020! The Invited Opening Keynote Speech on Telecommunications entitled 6G: Next Frontier in Wireless Communication Research will be given by Prof. Dr. Ian F. Akyildiz, IEEE & ACM Fellow – Ken Byers Chair Professor in Telecommunications, Georgia Institute of Technology, USA.
February 5, 2020! The SS2. Special Session on Photonic Fibre Networks and their Applications (Theory, Design, Modelling, Simulations, Operation, Trials) will be organized by Dr. Josef Vojtech (CESNET a.l.e., Czech Republic) and Dr. Tomas Horvath (CESNET a.l.e. and Brno University of Technology, Czech Republic).
January 15, 2020! Deadline for Special Session and Workshops Proposal is extended by February 15, 2020.
January 15, 202020! The International Workshop on Advanced Network Technologies and IoT organized by Assoc. Prof. Jorge Crichigno (University of South Carolina, U.S.A.), Assoc. Prof. Gautam Srivastava (Brandon University, Canada), and Prof. Dr. Neset Hikmet (University of South Carolina, U.S.A.) will be co-located with TSP 2020.
January 8, 2020! The SS1: Special Session on Multimodal Signal Processing and Classification will be organized by Prof. Dr. Corneliu Burileanu and Assoc. Prof. Dr. Anamaria Radoi (both with the University Politehnica of Bucharest, Romania).
December 15, 2019! The Paper Submission System is opened!
December 15, 2019! The 2nd International Workshop on Signal Processing Techniques for Ground Penetrating Radar Applications (SPT4GPRA) organized by Dr. Fabio Tosti, PhD, Prof. Dr. Amir M. Alani, PhD (both University of West London (UWL), London, UK), Prof. Dr. Evert Slob, PhD (Delft University of Technology, Delft, The Netherlands), and Dr. Francesco Soldovieri, PhD (National Research Council, Naples, Italy) will be co-located with TSP 2020.
December 3, 2019! The TSP 2019 Conference report is published in IEEE Communications Magazine – Global Communications Newsletter (November 2019, Vol. 57, No. 11).
November 21, 2019! The IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society technical co-sponsorship of the TSP 2020 Conference has been approved!
November 21, 2019! The TSP 2020 is registered in the IEEE Conferences & Events database under IEEE Conference Record #49548.
November 21, 2019! The IEEE PDF eXpress Plus ID of TSP 2020 Conference is 49548XP.
November 21, 2019! The IEEE has assigned the following catalog number to TSP 2020 Conference online proceedings: XPLORE COMPLIANT: CFP2088P-ART = ISBN 978-1-7281-6376-5.
November 18, 2019! The TSP 2019 Conference Proceedings are indexed in Web of Science (formerly Conference Proceedings Citation Index (CPCI) of Thomson Reuters), i.e. including with the IEEE Xplore® Digital Library, SCOPUS, DBLP, and Google Scholar in all announced databases (presented papers only)!
July 11, 2019! The 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) will be held during July 7-9, 2020, in Milan, Italy.
