TSP 2020 Conference to be an online event due to Coronavirus! The current worldwide situation regarding COVID-19 is seriously affecting all travel plans to/from Italy. The TSP 2020 Organizing Committee members have been monitoring the situation over the past weeks, with full attention for the health and safety of all presenters, exhibitors and attendees, and have explored all options to maintain the event as planned, in close cooperation with IEEE. The current situation, with restrictions imposed by the European Commission, the Government of Italy, Municipality of Milan, and the hosting venue, no longer allows the conference to proceed in the traditional face-to-face format in 2020. Therefore, it has been decided to organize TSP 2020 as a virtual conference during the same period of the planned physical event scheduled to Milan, from July 7 to 9, 2020. To implement this, the following actions are taken:

  • The OpenConf Peer Review & Conference Management System will be set up to allow authors of accepted papers in main tracks, workshops, and special sessions to mandatorily upload presentation file (.ppt, .pptx, or .pdf) or a presentation with recorded audio, and made available for online viewing by all registrants.

  • The virtual conference will not include the opening & closing sessions, keynote sessions, etc.

  • All papers presented in the virtual conference (having available presentation file for online viewing) will be submitted for indexing to the IEEE Xplore® Digital Library and other announced databases.

  • Authors of accepted papers must still register and pay a registration fee. The Conference Organizers will apply significant discount on registration fees and reserves the right to not include a paper to proceedings, if the Conference fee is not paid by due date.

  • Technical details concerning the size, format, and upload instructions for presentations with recorded audio will be announced later.

General Information

Welcome to the official website of the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP – IEEE Conference Record #49548), which will be held during July 7-9, 2020, in Milan, Italy.

In cooperation with the IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society, the TSP 2020 is organized by eighteen universities from Czech Republic, Hungary, Turkey, Croatia, Taiwan, Japan, Slovak Republic, Spain, Bulgaria, France, Romania, Slovenia, Greece, and Poland, for academics, researchers, and developers and it serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa. The international expansion motivates the organizers in their effort to providing a platform for exchanging information and experience to help to improve the level and extent of scientific cooperation between university students, academics, and employees of research centers. The official language of the conference is English.

All the accepted papers will be published in the conference proceedings issued online, which (containing only presented papers at the conference) will be submitted for indexing to the IEEE Xplore® Digital LibraryIEEE Conference Record #49548, Conference Proceedings Citation Index (CPCI) of Thomson Reuters (formerly ISI Proceedings), SCOPUS, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in special issues of international journals:

Comments are closed.

Copyright © ISIFA/Shutterstock/ - All Rights Reserved 2008-2016